Part Number Hot Search : 
P55NF R1500F LM148 KSV2103 ICL8020A MAX851 BL817S 1N974B
Product Description
Full Text Search
 

To Download BD9862MUV-E2 Datasheet File

  If you can't view the Datasheet, Please click here to try to view without PDF Reader .  
 
 


  Datasheet File OCR Text:
  1/16 www.rohm.com 2010.03 - rev.a ? 2010 rohm co., ltd. all rights reserved. power supply ic series for tft-lcd panels 5v input multi-channel system power supply ic bd9862muv description the bd9862muv is a 3ch system power supply for mobile tf t liquid crystal panels.operable at vbat=1.8v, ch2 & ch3 adopts the original pwm/pfm automatic sw itching control charge pump and realizes high efficiency in full-load range. features 1) input voltage range: 1.8v~4.5 v (the input voltage can be 5.5v if a double charge pump is not used) 2) the step-up switching regulato r has a built-in output fet (ch1) 3) there is a built-in pwm/pfm automatic switching charge pump circuit with a fixed pwm terminal (ch2,3) 4) switching regulator oscillation frequency: mhz(typ.) 5) charge pump oscillation frequency: 500khz(typ.) 6) there is a built-in circuit to discontinue outp ut (timer latch type) in the event of overload 7) package vqfn024v4040 applications small & medium tft liquid crystal displays etc. absolute maximum ratings (ta = 25c) parameter symbol ratings unit maximum adding power supply voltage vbat -0.3 ~ 7 v maximum adding voltage lx -0.3 ~ 18 v fb1, inv1, inv2, uvloset, c2n, vin2a, cn, cp, cpout, regout, pwm, rt ,vref ,non3 -0.3~7 vin3, c3p, vo2, c2p, vin2b -0.3~15.5 power dissipation pd 0.34(*1) w 0.70(*2) operating temperature range topr -40 ~ +85 storage temperature range tstg -55 ~ +150 junction temperature tjmax +150 (*1) when used as a stand-alone ic (for ta=25 and over), the value is reduced by 27mw/ . (*2) when used for printed circuit boards (glass epoxy board of 74.2mm74.2mm1.6mm) mounting for ta=25 and over, the value is reduced by 5.6mw/ . operating conditions(ta=25 ) parameter symbol ratings unit condition min typ max power supply voltage vbat 1.8 - 4.5 ( 1) v ch1output voltage vo1 - - 15 v ch2 output voltage vo2 - - 15 v ch3 output voltage vo3 -15 - - v starting capacit y , adding charge pump flying capacitor cflys,cflya 0.1 0.22 - f reversing capacity charge pump flying capacitor cflyi 0.022 0.047 - f starting charge pump output capacitance ccpout 1.0 2.0 - f ccpout R cfly*10 switching regulator oscillation frequency fosc1 700 1.0 1.4 mhz rrt=82k ? ~180k ? charge pump oscillation frequency fosc2 350 500 700 khz rrt=82k ? ~180k ? ch1 powernmos drain current iidn1 - - 1.0 a ( 1) when using a double charge pump for starting. 5.5v when not using a double charge pump no.10035eat16 downloaded from: http:///
technical note 2/16 bd9862muv www.rohm.com 2010.03 - rev.a ? 2010 rohm co., ltd. all rights reserved. electrical characteristics ( unless otherwise specified,ta=25 ,vbat=2.5v) parameter symbol limits unit condition min typ max starting circuit part output voltage vcpout 3. 7 4.2 4.7 v iout=0~10ma vbat voltage to start operation vst - - 1.8 v soft start part ch1soft start time tss1 0.5 1.0 2.0 ms r rt =120k ? ch2 soft start time tss2 3.5 5.0 6.5 ms r rt =120k ? ch3 soft start time tss3 3.5 5.0 6.5 ms r rt =120k ? oscillation circuit switching regulator frequency fosc1 0.9 1.0 1.1 mhz r rt =120k ? charge pump frequency fosc2 450 500 550 khz r rt =120k ? regulator output voltage vregout 3.4 3.5 3.6 v iout=0~10ma,vbat=2.0v~4.5v pwm comparator max duty1 dmax1 85 90 95 % max duty2 dmax2 40 45 50 % max duty3 dmax3 40 45 50 % error amplifier inv1threshold voltage vinv1 0.985 1.0 1.015 v inv2threshold voltage vinv2 0.985 1.0 1.015 v non3threshold voltage vnon3 0.985 1.0 1. 015 v making vref as absolute value ch3 error amplifier off set voltage voffset -50 0 50 mv output part(switching regulator nmosfet on resistance ronn1 0.2 0.45 0.7 ? regout=3.5v leak current when nmosfet off ireakn1 - - 10 a uvloset=0v adding step-up charge pump output impedance r2 - 53 90 ? io=0~10ma,vin2a=3.5v, vin2b=10v,inv2=gnd inverted charge pump output fet on resistance pmos ronp3 - 20 40 ? vin3=10v nmos ronn3 - 10 20 control terminal part pwm terminal pull down resistance rpwm 0.5 1 2 m ? pwm terminal control voltage operation vpwmh 1.2 - vbat v pwm fixed mode non-operation vpwml 0 - 0.3 v pwm/pfm auto shift mode short circuit protection circuit timer latch time latch 110 131 150 ms r rt =120k ? uvlo relief voltage threshold uvth 0.97 1.0 1.03 v hysteresis uvhy 50 75 100 mv circuit current circuit current during operation (vbat terminal inflow current) ivbat 0.4 0.8 1.6 ma vbat=5v, uvloset=inv1=inv2=5v non3=-0.2v it is not the radiation-proof design for this product. downloaded from: http:///
technical note 3/16 bd9862muv www.rohm.com 2010.03 - rev.a ? 2010 rohm co., ltd. all rights reserved. power dissipation reduction 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 0 25 50 75 100 125 150 ambient temperature ta () power dissipation pd w) 3.56w 2.21w 0.70w 0.34w : stand-alone ic : one-layer substrate (surface-layer heat release copper foil 0mm2) : four-layer substrate (surface and inside-layer heat release copper foil 10mm2) (2, 3 layer heat release copper foil 5505mm2) : four-layer substrate (all-layers heat release copper foil 5505mm2) : ja = 367.6 /w : ja = 178.6 /w : ja = 56.6 /w : ja = 35.1 /w downloaded from: http:///
technical note 4/16 bd9862muv www.rohm.com 2010.03 - rev.a ? 2010 rohm co., ltd. all rights reserved. reference data(unless specified ta=25 ,vcc=2.5v,r rt =120k ? ) a [] [] = = a [] [] a [] [] fig.1 ch1current load to efficiency (vo1=10v) fig.2 ch2 current load to efficiency (vin2a=3.5v,vin2b=10v,vo2=12v) fig.3 ch3 current load to efficiency (vin3=10v,vo3=-5v) a [] a[] a[] a[] a[] a[] fig.4 regout output load regulation fig.5 regout output line regulation fig.6 regout output voltage temperature feature a[] a[] a[] a[] a[] a[] fig.7 inv1 threshold voltage temperature feature fig.8 inv2 threshold voltage temperature feature fig.8 non3 threshold voltage temperature feature a[] [] a[] [] [] [] fig.10 ch1 fb1voltage- on duty feature fig.11 ch1 switching frequency temperature feature fig.12 ch1 switching frequency to vbat voltage feature downloaded from: http:///
technical note 5/16 bd9862muv www.rohm.com 2010.03 - rev.a ? 2010 rohm co., ltd. all rights reserved. reference data(unless specified ta=25 ,vcc=2.5v) a[] a [] a[] a [] a[] a [] fig.13 ch1 soft start temperature feature fig.14 ch2,ch3 soft start temperature feature fig.15 ch1 max duty temperature feature a[] a [] [] [] fig.16 ch2,ch3 max duty temperature feature fig.17 rt resistance to ch1 switching frequency feature block diagram a a a a a a a a a `?? fig.18 chi-ch3 driver stop downloaded from: http:///
technical note 6/16 bd9862muv www.rohm.com 2010.03 - rev.a ? 2010 rohm co., ltd. all rights reserved. terminal location diagram fig.19 terminal number and terminal name and function terminal number terminal name function 1 fb1 error amplifier output terminal for ch1 2 inv2 error amplifier inve rted input terminal for ch1 3 uvloset uvlo standard voltage terminal 4 vin3 reversing charge pump input terminal 5 c3p reversing charge pump. flying capacitor h-side input terminal 6 pgnd2 built-in eft grounding terminal for ch2,3 7 c2n adding step-up charge pump. flying capacitor l-side input terminal 8 vin2a adding step-up charge pump input terminal 9 vo2 adding step-up charge pump output terminal 10 c2p adding step-up charge pump. flying capacitor h-side input terminal 11 vin2b adding step-up charge pump input terminal 12 lx inductor connecting terminal 13 pgnd1 built-in fet grounding terminal for chi1 14 cn start-up charge pump. flying capacitor l-side input terminal 15 cp start-up charge pump .flying capacitor h-side input terminal 16 vbat power supply input terminal 17 cpout start-up charge pump output terminal 18 regout regulato r output terminal 19 pwm charge pump block pwm/pfm switching terminal 20 gnd grounding terminal 21 rt connecting terminal of resistor for frequency timing setting 22 vref standard voltage output terminal 23 non3 non-reversing input terminal of error amplifier for ch3 24 inv1 reversing input terminal of error amplifier for ch1 downloaded from: http:///
technical note 7/16 bd9862muv www.rohm.com 2010.03 - rev.a ? 2010 rohm co., ltd. all rights reserved. system description bd9862muv is a 3ch system power supply optimized for tft liquid crystal displays. features of each channel are explained as follows ch1 this is a voltage mode switching regulator with a built-in high voltage-resistant output fet. capable of high-spee d operation at the maximum switching frequency of 1. 4mhz, and compatible with a high step-up ratio with max duty of 90%(typ.). ch2 its a pwm/pfm automatic switching control with a variable-vol tage adding charge pump. due to intermittent switching at the time of pfm mode, the switching loss is reduced, so high ef ficiency is realized even in light load conditions. moreover, it is capable of operating at the maximum switching frequency of 700khz bec ause of a built-in high voltage resistant, high-speed fet driver. in addition, it is equipped with an on duty prediction function, so the output voltage ripple is lowered considerably even at the time of pfm operat ion.due to the built-in output discharge resistor (1k ? typ.) and fet phase compensation circuit, it can operate with two capacitors and two resistors. ch3 it includes a pwm/pfm automatic switchi ng control, variable-voltage reversing charge pump controller. the control method is the same as ch2. block functional descriptions ? error amplifier block detects the output voltage with inv terminal (non3 terminal in case of ch3), amplifies the error between it and standard voltage, and outputs from the fb terminal. the a ccuracy is 1%(1.5% in case of ch2 & ch3). ? pwm(pulse width modulation)convertor block the pwm convertor inputs the error detected by the error amplifier and outputs the pwm signal by comparing with a saw-tooth wave. ? pwm/pfm control block due to the input of the pwm terminal, this block switches the ch2 & ch3 between the fixed pwm mode and the automatic switching mode of pfm(pulse frequency modu lation)/pwm. at the time of pfm mode, the efficiency under a light load is raised by controlling and making the lowest on duty of pwm signal to be 7%(typ.) and reducing the number of switching times. ? ldo block this is a power supply to operate the internal circuit. in addi tion, it can be used as input of vin2b. the output voltage is 3.5v(typ.), and the maximum load is 10ma. moreover, due to a built-in uvlo, the release voltage is 2.5v(typ) and the protective voltage is 2.4v(typ). ? start-up charge pump block if regout is 2.5v(typ.), then the ring oscillator, which operates at 500khz or so, is started and the double charge pump is operated. the clock pulse is controlled in such a way that the output voltage of this charge pump becomes 4.2v(typ.). moreover, if regout becomes more than 2.5v(typ.) (i.e. regout 2.5v(typ.)), then the clock is supplied from the main osc that creates a saw t ooth wave. if the input voltage is usually more than 4.5v, then it is possible to bypass the start-up circuit. (refer to the application example) ? osc block it generates a saw-tooth wave and inputs it into the pwm comparator. it is possibl e to change the oscillating frequency by means of the resistor rt. due to rrt=120k ? , the ch1 operates at 1mhz(typ.). the double charge pump, ch2 and ch3 operate at 1/2 of ch1 frequency. ? vref block generate the constant voltage that is standard inside the ic. ? uvlo block performs the under voltage lockout by detecting the vbat vo ltage with the uvloset terminal. the uvlo voltage can be set by an exte rnal resistor. ? soft start block due to sweep-starting of the standard voltage of the error amplif ier at the ti me of start-up, the excess input current & output voltage is reduced. moreover, only at the time of soft start, the ch2 is regarded as the resistance value of 150 ? typ between vin2b & c2p and the ch3 is regarded as the resistance value of 60 ? typ between vin3 & c3p therefore the input current is limited. ? short-circuit protection of timer latch (scp) block monitors the inv1 terminal and the error amplifier outputs of ch2 & ch3, and turns off the drivers of ch1~ch3 if a short-circuit condition continues for more than a certain period of time. the timer latch time is counted by the ch1 internal switching pulse. the counting is started when a short-circuit condition begins, ant the drivers are turned off when 131,072 is reached. example) if rrt=120k ? , then 131072(1/1[mhz])=131.072ms ? thermal shutdown (tsd) block detects abnormal heat generation of the ic, stops the switching operation of a ll ch and prevents the ic from thermal overload. the detecting temperature is 175 (typ), and the hysteresis is 10 (typ). downloaded from: http:///
technical note 8/16 bd9862muv www.rohm.com 2010.03 - rev.a ? 2010 rohm co., ltd. all rights reserved. timing chart 1) when starting fig.20 2) sample scp operation when ch1 is short fig.21 ` ? ? ? ? ?j ` `?? ?? normal operation vo1 output short circuit scp capacitor output (internal) scp latch (internal) scp timer operation driver stop (ch2, ch3 stop too) max duty operation ` _? ?` _? ?` K _? _? _? ?` K ??K vbatuvlo release 2 times charge pump start on regulator start on regoutuvlo relief vo1 soft start close ch1 start on ch2 start on ch3 start on vo3 soft start close a ll ch start close downloaded from: http:///
technical note 9/16 bd9862muv www.rohm.com 2010.03 - rev.a ? 2010 rohm co., ltd. all rights reserved. 3) sample scp operation when ch2 is short operates similarly at the time of ch3 short-circuit. fig.22 ` ? ? ? ? `?? ?? ? ? ?j ` output short error out2 (internal) os c slop (internal) driver stop ( ch1 , ch3 sto p too ) scp timer operation scp capacitor output (internal) scp latch (internal) normal operation max duty operation downloaded from: http:///
technical note 10/16 bd9862muv www.rohm.com 2010.03 - rev.a ? 2010 rohm co., ltd. all rights reserved. method to select the application parts 1) setting of output voltage the output voltage vout is set by dividing the resistance of the external resistor. ch1,ch2:vout=1+r2/r1 ch3:vout=-((r4/r3)+voffset) r1: feedback resistor (gnd side), r2: feedback resist or (vout side), r3: feedback resistor (vref side), r4: feedback resistor (vout side) 2) setting of the output inductor the maximum current i lpeak that flows in the inductor is calculated by the sum of the average current i D l and the maximum value of ripple current S i l. i lpeak = i D l + S i l. generally S i l. is set to about 30% of i D l . the average current i D l and the ripple current S i l. are calculated according to the following formulas. max out min in out max l i v v i ? ? ? out osc in out min in l v l f2 v v v i ? ? ? ? ? ? S l: value of inductance f osc : switching frequency v inmax : maximum input voltage v inmin : minimum input voltage vout: set value of output voltage please set in such a way thati lpeak (the rated value of inductor current) is not exceeded. if i lpeak exceeded, then the efficiency is lowered extremely and damage to the inductor is caused. please set in such a way that a good margin is left because the inductance varies in value. 3) setting of output capacitor the capacitance & esr of the output capacitor is influenced a great deal by output voltage ripple. moreover, pfm mode intentionally makes the switching intermittent, so the output voltage ripple becomes larger compared with pwm mode. please use an appropriate capacitor according to the service condition. in addition, please be sure to connect a ceramic capacitor of 1f to regout terminal. it is assumed that this ic uses a multilayer ceramic capacitor. for small multilayer ceramic ca pacitors such as size 1608 etc., its actual capacitance may be lower than its nominal one because of the voltage that is bypassed. please check to confirm various characteristics su ch as dc bypass etc. before use. 4) setting of flying capacitor please set the capacitance of the flying capacitor of the start- up charge pump not to exceed 1/ 10 of the capacitance of the cpout output capacitor. if it is more than 1/ 10 of the capacitance, damage may be caused. 5) setting of the input capacitor a bypass capacitor for input is necessary to the vbat terminal. due to input & output voltage, load and wiring pattern etc., the actual capacitance is different from the necessa ry one, so please care fully check to confirm. 6) setting of cr for phase compensation the cr for phase compensation is varied due to t he characteristics of the capacitor & inductor, which are used in the output part, the input & output voltage and the load current etc. the phase-compensation cr constant in a recommended circuit diagram is set according to the service conditions, but applications under other conditions than the various conditions mentioned will cause oscillation instability etc. please contact our technica l service department if any conditions are changed. 7) setting of schottky diode in the output part please use a schottky diode with an allowable current more than i lpeak for the output part. furthermore, it is necessary that the maximum reverse voltage is more than output voltage. generally speaking, more lower the forward voltage, the higher the efficiency. 8) setting of uvlo voltage the vulo release voltage vuvlo can be set according to the following formula: vuvlo=1+r2/r1(r1 =gnd-side resistance r2 =vbat-side resistance) if you want to make the start-up of the ic to lag behind the rising edge of vbat, connect a capacitor to the uvloset terminal and set the time constant. 9) setting of oscillating frequency oscillating frequency can be adjusted by a resistor connected to the rt terminal. the ch1 oscillating frequency fosc1 is determined by the formula shown below: fosc1=1/(810 -12 r rt +410 -8 ) the frequency calculated by the formula shown above is a theor etical value, so please refer to the above-mentioned reference data rt resistance vs. ch1 switching frequency characteristic for actual frequency. downloaded from: http:///
technical note 11/16 bd9862muv www.rohm.com 2010.03 - rev.a ? 2010 rohm co., ltd. all rights reserved. operating guidelines ? pwm terminal at low the pfm mode skips the pulse of less than 7% on duty . it is also switched over to the pwm mode if a certain amount of load is reached or exceeded while in pfm mode. moreover, it is switched to pfm mode if the load becomes light. please set the pwm terminal to high and use as the forc ed pwm mode if there is an influence of noise created by modulation of the switching frequency. ? scp function in case of circuit stoppage due to scp, the protection is released by setting the uvloset voltage to l and the vbatt to off. ? ch2 adding charge pump please set the vo2 so that the vin2a+vi n2b become not more than 15v because the voltage that is the sum of the vin2a voltage plus the vin2b voltage is applied. downloaded from: http:///
technical note 12/16 bd9862muv www.rohm.com 2010.03 - rev.a ? 2010 rohm co., ltd. all rights reserved. sample of recommended circuit 1) sample of input voltage 1.8v~4.5v application = ~ a a a a a a fig.23 ? recommended parts l1 : nr4010t4r7m(taiyo yuden) ccpout : grm188b30j225ke18(murata) d1 : rb161va-20(rohm) cregout : grm155b30j105ke18 (murata) d3 : dan217u(rohm) cout2, cout3 : grm188b31c225ke14d(murata) cout1 : grm31cb31c106ka88(murata) cflys : grm155b10j224ke01(murata) cin : grm219b30j106ke18(murata) cfly2, cfly3 : grm155b11c473ka01(murata) downloaded from: http:///
technical note 13/16 bd9862muv www.rohm.com 2010.03 - rev.a ? 2010 rohm co., ltd. all rights reserved. 2) sample of input voltage 4.5v~5.5v application = ~ a a a a a a fig.24 ? recommended parts l1 : nr4010t4r7m(taiyo yuden) ccpout : grm188b30j225ke18(murata) d1 : rb161va-20(rohm) cregout : grm155b30j105ke18(murata) d3 : dan217u(rohm) cout2, cout3 : grm188b31c225ke14d(murata) cout1 : grm31cb31c106ka88(murata) cflys : grm155b10j224ke01(murata) cin : grm219b30j106ke18(murata) cfly2, cfly3 : grm155b11c473ka01(murata) downloaded from: http:///
technical note 14/16 bd9862muv www.rohm.com 2010.03 - rev.a ? 2010 rohm co., ltd. all rights reserved. input / output equivalent circuit lx inv1, inv2, non3 fb1 uvloset cn cp, cpout regout pwm rt, vref vin2a, c2n vin2b vo2, c2p vin3, c3p fig.25 input / output equivalent circuit points for attention on pcb layout place the resistors and capacitors, that are connected to rt, inv1, fb1, inv2, non3 and vref, close to the terminals to avoid being affected by the wirings, where switching is la rge, such as lx1 wiring and flying capacitor wiring etc. place the inductor, schottky diode and flying capacitor close to the ic. mount in such a way that the back side of the package serves as the gnd potential which covers the largest space in the pcb. heat dissipation performance is improved. downloaded from: http:///
technical note 15/16 bd9862muv www.rohm.com 2010.03 - rev.a ? 2010 rohm co., ltd. all rights reserved. notes for use 1.) absolute maximum ratings this is a high quality product, but if absolute maximum rating such as applied voltage and operating temperature range is exceeded, then deterioration or breakdown may result. mo reover, such destructive conditions as short mode or open mode can not be assumed. if a particular mode such as exceeding the absolute maximum rating is assumed, consideration should be given to using physical safety measures such as a fuse. 2.) cnd potential the electric potential of the gnd pi n should be the lowest electric pot ential under any operating state. in addition, (including transient phenomenon), do not make the electrical potential of any pin lower than the gnds. 3.) thermal design use a thermal design that allows for a suffic ient margin in light of the power dissipa tion (pd) in actual operating conditions. 4.) inter-pin shorts and mounting errors use caution when orienting and positioning the ic for mounting on printed circuit boards. improper mounting may result in damage to the ic. in addition, shorts between output pins or between output pins and the power supply gnd pin caused by the presence of a foreign object may result in damage to the ic. 5.) operation in a str ong electromagnetic field use caution when using the ic in the presence of a strong electr omagnetic field as doing so may cause the ic to malfunction. 6.) common impedance power supply and gnd wiring should reflect consideration of the need to minimize ripples as much as possible., (which lower common impedance), by making wiring as short and thick as possible or incorporating inductance and capacitance. 7.) thermal shutdown circuit (tsd circuit) this ic incorporates a built-in thermal shutdown circuit (tsd circuit). the tsd circuit is designed not for the purpose of protection & guarantee of the ic, but only to shut the ic off to prevent t hermal overload. therefor e, do not use the ic on the premise that this tsd circuit will be operated to shut the ic off (or the ic will be continued to be used after this tsd circuit is operated to shut the ic off). 8.) ic pin input this monolithic ic contains the p+ isolation between adjac ent elements in order to k eep them isolated from the p substrate. due to this p layer and the n layer of each element, the p/n junctions are formed and various kinds of elements are created. for example, if a resistor and a transistor are c onnected with pins as shown in the fig., then: the p/n junction functions as a parasitic diode when gnd > (pin a) for the resistor or gnd > (pin b) for the transistor (npn). moreover, when gnd > (pin b) for the transistor (npn), the parasitic npn transistor is operated by n layer of other elements adjacent to the above-mentioned parasitic diode. the formation of parasitic elements as a result of the relationshi ps of electric potentials is an inevitable result of the ic's architecture. the operation of parasitic elements can cause interference with the circuit operation as well as ic malfunction and damage. for these reasons, it is necessary to use caution so that the ic is not used in a way that will trigger the operation of parasitic elements, such as by the ap plication of voltages lower than the gnd (p substrate) voltage to input pins. fig.26 simple structure of monolithic ic (sample) (terminal a) gnd parasitic element parasitic element transistor (npn) gnd p substrate n p n n p + p + (terminal b) b n e c gnd p substrate n p n n p + p + (terminal a) parasitic element resistance downloaded from: http:///
technical note 16/16 bd9862muv www.rohm.com 2010.03 - rev.a ? 2010 rohm co., ltd. all rights reserved. ordering part number b d 9 8 6 2 m u v - e 2 part no. part no. package muv: vqfn024v4040 packaging and forming specification e2: embossed tape and reel (unit : mm) vqfn024v4040 0.08 s s 16 7 12 19 24 13 18 0.4 0.1 0.02 +0.03 - 0.02 1pin mark 2.4 0.1 c0.2 0.5 4.0 0.1 0.75 2.4 0.1 4.0 0.1 1.0max (0.22) 0.25 +0.05 - 0.04 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin downloaded from: http:///
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///


▲Up To Search▲   

 
Price & Availability of BD9862MUV-E2

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X